Renesas and Nidec Announce World’s First 8-in-1 MCU for E-Axle Systems in Electric Cars
New E-Axle Solution to be Showcased in a Live Demonstration at electronica 2024, Munich, Germany from November 12-15 TOKYO, Japan, ...
Read moreNew E-Axle Solution to be Showcased in a Live Demonstration at electronica 2024, Munich, Germany from November 12-15 TOKYO, Japan, ...
Read moreSmartAutomotiveTM IAM-20685HP and IAM-20689 are second generation 6-axis MEMS IMUs suited for safety-relevant automotive applications up to ASIL D Compact in size ...
Read moreNews highlights: The new TMS320F28P55x series of C2000™ MCUs with an integrated edge artificial intelligence (AI) hardware accelerator enables smarter ...
Read moreThe Treo Platform features a modular architecture to accelerate development of intelligent power management, sensor interface and communications solutions NEWS ...
Read moreHoofddorp, Netherlands: Murata is pleased to unveil ZENCROSS™, an alliance offering integrated hardware, firmware and network services platform designed to address ...
Read moreInitial efforts to focus on silicon carbide MOSFETs in QDPAK for onboard chargers Nijmegen, November 5, 2024: Nexperia today announced ...
Read moreMunich, Germany – 4 November 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the launch of ...
Read moreInnovative Solution Offers Highly Compact Form Factor Combined with Improved Battery Life, Enabling the Next Generation of AI PCs TOKYO, ...
Read moreNew MCUs are Ideal for Home Appliances, Building Automation and More TOKYO, Japan ― October 22, 2024 ― Renesas Electronics ...
Read more, – MosChip® Technologies is now an AI/ML design partner under Renesas RZ partner ecosystems, delivering intelligent solutions based on ...
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