Infineon presents first high-density trans-inductance voltage regulator (TLVR) power modules optimized for AI data centers

Munich, Germany – 01 October 2025 – As a result of the rapid growth of cloud-based services, particularly those enabling artificial intelligence (AI), data centers are now responsible for more than two percent of global energy consumption. This figure is expected to rise further, with exponential growth of 165 percent predicted between 2023 and 2030. Continuously improving efficiency, power density, and signal integrity of power conversion from the grid to the core is therefore critical to advancing computing performance while reducing total cost of ownership (TCO). To address this need, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching the OptiMOS™ TDM22545T dual-phase power module, the industry’s first trans-inductance voltage regulator (TLVR) module specifically designed for high-performance AI data centers.

The module’s proprietary TLVR inductance architecture minimizes the number of output capacitors, reducing the overall size of the voltage regulator (VR) and significantly lowering material costs (bill of material; BOM).

“With the OptiMOS TDM22545T, we are continuing our innovation efforts to deliver benchmark power density and transient response for power modules that are critical for powering AI data centers,” says Rakesh Renganathan, Vice President Power ICs at Infineon. “By integrating a proprietary TLVR inductor with robust OptiMOS technology and thermally enhanced chip-embedded packaging, and by leveraging Infineon’s system expertise, we continue to accelerate green computing as part of our mission to drive digitalization and decarbonization.”

The OptiMOS TDM22545T module combines robust trench technology power stages with proprietary TLVR inductors. This results in excellent power density, improved electrical and thermal efficiency, and enhanced signal quality with reduced transients. The inductor design delivers an ultra-fast transient response to dynamic load changes caused by AI workloads without compromising electrical and thermal efficiency. This directly translates into increased computing throughput, a robust system design, and reduced TCO for AI data centers. The new module is also compatible with vertical power delivery (VPD) systems, where power delivery network (PDN) losses can be reduced up to 50% versus traditional top-side lateral designs. It supports up to 140 A across both phases in a compact form factor of 9 x 10 x 5 mm³. Combined with Infineon’s XDP™ controllers, the AI power module family offers the industry’s most robust solution for powering AI data center applications.

Availability
The OptiMOS TDM22545T dual-phase power module is available now on request. Further information is available here.

The product will also be showcased at Infineon’s OktoberTech Silicon Valley 2025. More information is available at www.infineon.com/event/oktobertech.