Samtec’s ultra micro mPOWER connector system is now available with through-hole PCB termination options for enhanced mechanical strength and reliability in industrial, military, and aerospace applications.
New Albany, IN: Samtec, Inc., the service leader in the connector industry, announces product expansion of its popular mPOWER ultra micro power interconnect system. mPOWER vertical board connectors (UMPS, UMPT) and right-angle board connectors (UMPT-RA) are now available with through-hole board termination options, providing the enhanced mechanical robustness that is often required in harsh industrial, military, and aerospace applications. Connector designs using surface mount technology are also available.
Designed for power density, mPOWER ultra micro connectors offer a 40% space savings over conventional power connectors. Their compact form factor supports up to 18 A per power blade, enabling reliable high current performance without sacrificing board space.
In addition to power density, mPOWER interconnects provide design flexibility across board-to-board, wire-to-board, and wire-to-wire applications. System design is simplified through a range of options, including vertical and right-angle configurations, stack heights from 5 mm to 20 mm, rugged latching features, and 2 to 10 power positions. PVC or Teflon® fluoropolymer cable assemblies are available in multiple wire gauges to support varying application needs.
To simplify the design process, Samtec’s mPOWER connectors are accompanied by free access to design resources such as prints, models, and test reports. Engineers can evaluate power requirements, form and fit at samtec.com/mpower or by contacting Samtec’s Rugged/Power Group at RuggedPower@samtec.com. Full production quantities are available directly from Samtec or through authorized distribution partners.
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