Siemens democratizes EDA software access for European electronics industry through the Chips JU European Chips Design Platform (EuroCDP) project

• Streamlined access to advanced electronic design automation (EDA) software for European semiconductor innovation
• Lowers barrier for smaller companies, startups and research institutions

Siemens has become the first software provider to sign a strategic framework agreement with the European Chips Joint Undertaking (Chips JU) which aims to bolster Europe’s semiconductor industry by fostering collaboration between the EU, member states and the private sector, through the European Chips Design Platform (EuroCDP) project.

This collaboration grants companies accepted into the Chips JU program access to Siemens’ cutting-edge electronic design automation (EDA) software under pre-defined pricing and conditions.

“The agreement significantly lowers barriers for smaller companies, startups and research institutions to access world-class design, verification and manufacturing software – the same powerful tools used by industry giants. This creates a more level playing field for innovation within the European semiconductor ecosystem,” said Jean-Marie Saint Paul, senior vice president, EDA Global Sales, Siemens EDA, Siemens Digital Industries Software. “By being the first software provider to establish this framework, we’re demonstrating Siemens’ commitment to European technological leadership and positions us as key player in shaping the future of European microelectronics.”

“The contract with Siemens is a key enabler for our Design Platform” says Jari Kinaret, the Executive Director of the Chips Joint Undertaking. “The Design Platform is an essential part of the capacity build-up under the Chips Act, helping European startups and SMEs to develop into profitable fabless businesses.”

The collaboration enables EuroCDP participants to:

• Accelerate innovation cycles and reduce development costs
• Focus on design and innovation rather than lengthy procurement negotiations
• Access comprehensive digital twin capabilities and AI-driven design tools
• Achieve cost predictability crucial for R&D budget management

To learn more about Siemens’ work with the EuroCDP to the European Chips Act’s goals of strengthening technological sovereignty and competitiveness by providing essential tools for creating next-generation semiconductor solutions, visit https://eurocdp.eu/