Indium Corporation to Highlight High-Reliability Solder, Low-Silver, and Thermal Management Solutions at Productronica India

CLINTON, N.Y., September 1, 2026 — With a team of manufacturing and technical experts supporting customers across India, Indium Corporation will feature its portfolio of high-performance solder pastes, lower-cost, low-silver solder alloys, and thermal interface materials solutions at Productronica India, September 16-18, in Bengaluru, India.

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The company will feature the following products:

Durafuse^® Technology is a patented solder paste alloy system that delivers breakthrough performance in solder joint quality and reliability in complex designs. Trusted across industrial applications, it achieves exceptional reliability at lower processing temperatures—reducing your carbon footprint and improving process yields.

• • Durafuse^® LT is a low-temperature alloy ideal for large BGA assemblies prone to temperature-induced warpage, uneven PCB heating during reflow, or assemblies with temperature-sensitive components. It reduces peak reflow temperatures while exhibiting superior thermal cycling and drop-shock performance.
  • Durafuse^® HR delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding control for high-reliability automotive and mobile infrastructure applications.
• Indium12.9HF is a no-clean, halogen-free solder paste specifically formulated to accommodate fine-feature printing, as seen with 01005 and 008004 components. It offers unprecedented stencil print-transfer efficiency to work in the broadest range of processes to boost SPI yields. Indium12.9HF also delivers low voiding at BGA, CSP, LGA, and QFN, and high oxidation resistance without graping or solder balling on pads as small as 175 microns in air reflow.
• Indium10.1HF is an air-reflow, no-clean, halogen- and Pb-free solder paste specifically formulated to have ultra-low voiding, especially for designs that incorporate large ground pads. Its flux chemistry improves reliability by minimizing voiding and maximizing ECM and Head-in-Pillow (HIP) performance while also providing excellent wetting, solder beading, solder balling, and slump.
• Indium10.8HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.

To learn more about Indium Corporation’s high-reliability thermal management and low-silver alloy solutions, visit indium.com or meet our company experts at Productronica India 2026, Booth H4.B81.