(WATERBURY, CT) – September 10, 2026 – MacDermid Alpha Electronics Solutions will highlight advanced materials engineered to improve reliability, process consistency and performance in increasingly complex electronics applications at Productronica India 2026, September 16-18, at the Bangalore International Exhibition Centre in Bengaluru.
Electronic systems are becoming denser, more powerful and more sophisticated, placing greater demands on the materials used to protect them and ensure reliable performance throughout their operating life. MacDermid Alpha brings together materials and process technologies spanning circuit board protection, electronics assembly and advanced power and semiconductor applications to help manufacturers address these converging performance requirements.
Among the technologies on display is the recently introduced Electrolube® UVFlex, an advanced UV-curable conformal coating developed to combine efficient processing with durable protection in demanding electronics applications.
Engineered for efficient, consistent processing, UVFlex cures rapidly under UV light while a secondary moisture-cure mechanism protects areas not directly exposed during processing. Its flexible chemistry supports enhanced performance under demanding thermal and environmental conditions, while a PFAS-free formulation with 25 to 30% bio-based content aligns with evolving material requirements.
“The demands on electronic assemblies continue to increase, both in production and in the environments where they ultimately operate,” said Padmanabha Shakthivelu, Director of Product Management, MacDermid Alpha Electronics Solutions. “UVFlex was developed to respond to both, combining efficient UV processing with the thermal and electrical performance needed for long-term reliability. That combination is especially relevant as manufacturers look to improve process efficiency while designing for more demanding applications.”
Additional technologies on display address manufacturing requirements across fine-feature assembly, material efficiency and power electronics. These include ALPHA® OM-377 solder paste for ultra-fine-feature printing, ALPHA OM-100 SnCX® 07 silver-free solder paste with enhanced mechanical strain resistance, and ALPHA EF-6038HF no-clean flux with ultra-low residue and excellent hole filling. For power electronics, Argomax® silver sintering and the ATROX® die attach portfolio support reliable thermal, electrical and packaging performance. The Micromax™ portfolio will also be featured, including LTCC materials for telecom and defense, materials for passive components, and Green Tape™ materials supporting reliable probe card applications.
Together, these technologies demonstrate MacDermid Alpha’s broader approach to electronics manufacturing, bringing together materials and process expertise across circuit board protection, precision assembly, thermal management and interconnect reliability to address the requirements of increasingly complex electronic systems.
MacDermid Alpha’s technical experts will be available at Booth H4.G35 throughout Productronica India 2026 to discuss application challenges, material considerations and developments across electronics manufacturing. Meet our experts at Productronica India 2026 and discover the materials and process technologies designed to address the demands of modern electronics manufacturing.
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