Munich, Germany – 14 October 2026 – With artificial intelligence evolving from virtual chatbots into real-world machines and devices, it will shape our lives more than ever. At the electronica trade fair 2026 in Munich, Germany (10 – 13 November), Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will showcase customer cases, system solutions, and semiconductor innovations for Physical AI across robotics and mobility, intelligent edge devices as well as the infrastructure necessary to power the age of AI. Technology from Infineon helps machines perceive their environment, communicate in a secured way, process data locally through edge AI, and act on it safely and reliably while using energy as efficiently as possible. Visitors will find Infineon at booth 502 in hall C3.
“Many future machines will sense, think, and act autonomously in real-time, creating unprecedented opportunities in areas ranging from everyday convenience to healthcare, mobility, energy efficiency and economic productivity,” said Andreas Urschitz, Chief Marketing Officer at Infineon. “As AI advances from the cloud to the edge and into the physical world, semiconductor innovation is becoming the critical foundation to deploy intelligence efficiently and turn it into action people can rely on. At electronica, we showcase how, together with our customers and partners, we are building the technology foundation for the AI era.”
Infineon will present its contributions along three focus topics:
Physical AI in robotics and edge solutions
Robotics is Physical AI’s most complex form, with use cases across the shop floor, the service sector and the home. Semiconductors from Infineon enable every functional block in a robot, from sensing, computing, connectivity to motor control and power. Together, they translate perception into precise movement, while functional safety and cybersecurity embedded at hardware-level provide an anchor of trust for even the most advanced robots.
At electronica, visitors at the Infineon booth will witness Physical AI in action with a live robotics showcase performing a real-world shop floor use case. Furthermore, Infineon will demonstrate several robotics solutions on a system level, including an out-of-the-box solution that enables the precision and efficiency required to replicate the most dexterous part of a human body: a hand. Beyond that, the Infineon booth will provide insights into how edge intelligence enables a new generation of devices from industrial automation to smart home security, and everyday home appliances. The exhibit will also highlight how Infineon helps strengthen the security of intelligent and connected machines against evolving cyber threats in the quantum computing era.
Future mobility with software-defined electric vehicles
In modern vehicles, AI increasingly takes the wheel. It interprets sensor data in driver assistance and automated driving functions, helps to extend driving range and battery longevity, and is expected to become part of the control loop, enabling cars to adapt motion control dynamically to road and energy conditions, for example. In addition, the software-defined era allows connected vehicles to evolve over time, with new software from the cloud improving existing and adding new functions after the vehicle left the factory.
At electronica, Infineon will showcase how its semiconductor and system innovations support this transition and help turn software and AI into reliable vehicle behavior. Visitors can explore core technologies for centralized vehicle architectures at the heart of this development and will see an example implementation in a premium car. They will see system-level innovation empowered by Infineon, for example for AI-enhanced battery management, integrated x-in-1 powertrain solutions and next-generation Ethernet connectivity that provides safe and secured high-speed communication between vehicle systems. Visitors will also get a first glimpse at Infineon’s next automotive microcontroller platform that will leverage the advantage of the open standard RISC-V to bring new levels of intelligence, scalability, safety and security to software-defined vehicles and other Physical AI systems.
Powering the future from renewable power generation to AI data centers
Artificial intelligence is driving a massive expansion of digital infrastructure, creating unprecedented demand for computing power and electricity. Meeting this demand sustainably depends on intelligent power systems that generate, convert, distribute and manage energy efficiently, from renewable energy sources and the electrical grid all the way to the processor core inside an AI server.
At electronica, Infineon will demonstrate how its semiconductor innovations help build this foundation. Visitors will discover technologies that improve energy efficiency throughout the entire power chain, enabling AI data centers to deliver more computing performance while reducing energy losses. They will see solutions that optimize energy delivery from the grid to advanced AI processors, explore next-generation solid-state power distribution technologies, and learn how renewable energy and grid-forming battery storage systems can help keep future electricity networks stable and resilient. By combining power, control, sensing, connectivity and security technologies, Infineon helps connect the worlds of energy and intelligence to power the future.
Where to find Infineon at electronica
The electronica trade fair is taking place from 10 to 13 November in Munich, Germany. Infineon will present its solutions at booth 502 in hall C3. Further information is available at www.infineon.com/electronica.
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