ISIG Executive Summit India 2026 to Convene Global Semiconductor Leaders in New Delhi

The two-day summit will spotlight opportunities in advanced packaging, AI infrastructure, data centers and power electronics.

New Delhi, 2 November 2026: The International Semiconductor Industry Group (ISIG) will host the ISIG Executive Summit India 2026 on 3-4 November 2026 at The LaLiT, New Delhi. The two-day summit brings together senior executives, global technology leaders, researchers, investors and government stakeholders to discuss the future of the semiconductor industry and India’s expanding role in the global semiconductor ecosystem.

Under the theme ‘Enabling the Intelligent Future: Advanced Semiconductors, AI, Data Centers and Power Electronics,’ the summit features keynote addresses, panel discussions and business meetings covering advanced packaging, semiconductor manufacturing, AI infrastructure, photonics, power electronics, wide-bandgap technologies and global supply-chain development.

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The summit will convene leading global organisations, including UCLA, Georgia Institute of Technology, imec, Infineon, Mitsubishi Electric, Renesas, Nexperia, Navitas, Marvell, Sandisk, GlobalFoundries, Yole Group and AT&S, alongside Indian industry leaders and ecosystem stakeholders. Participation from the India Semiconductor Mission (ISM), the Semiconductor Laboratory (SCL), state government representatives from Madhya Pradesh and Tamil Nadu, and Invest India underlines the importance of industry-government collaboration in strengthening India’s semiconductor capabilities.

India’s semiconductor ecosystem has seen significant policy and investment momentum. According to the Ministry of Electronics and Information Technology (MeitY), as of July 2026, 12 semiconductor manufacturing units had been approved across the country, with cumulative investment commitments exceeding ₹1.64 lakh crore. These projects span silicon and compound semiconductor fabrication, display manufacturing and advanced packaging, reflecting the country’s growing ambitions across the semiconductor value chain.

Further strengthening this momentum, the Union Cabinet approved the next phase of the Semicon India Programme, Semicon 2.0, on 15 July 2026, with a total outlay of ₹1,27,500 crore. The programme aims to deepen India’s capabilities across chip design, manufacturing, advanced packaging, research and development, equipment, materials and talent development.

India’s established strength in semiconductor design also presents a significant opportunity. According to MeitY, India accounts for nearly 20% of the global semiconductor chip-design workforce, reinforcing its position as a key destination for semiconductor research, design and engineering.

Against this backdrop, discussions at the summit will focus on India’s opportunities in advanced packaging, Outsourced Semiconductor Assembly and Test (OSAT), power electronics, chip design, materials and semiconductor equipment. Growing demand from AI applications and data centers is creating opportunities across memory, connectivity, power management and advanced packaging. Wide-bandgap technologies such as Silicon Carbide (SiC) and Gallium Nitride (GaN) are gaining importance across electric mobility, renewable energy and industrial applications, opening avenues for India to strengthen its domestic design, manufacturing, packaging and testing capabilities.

Speaking ahead of the summit, Salah Nasri, CEO and Co-Founder of ISIG, said: “India is no longer a future chapter in the global semiconductor story; it is a present one. The opportunity lies in building meaningful capabilities and strengthening India’s contribution to the global value chain. Through ISIG, we aim to bring global industry leaders, policymakers and investors together to translate India’s semiconductor ambitions into tangible partnerships and long-term growth.”

Santosh Kumar, President, ISIG India, and CEO, Paras Semiconductors, said: “India has a significant opportunity to strengthen its position in the global semiconductor ecosystem, particularly in advanced packaging, OSAT and power electronics. The focus must now be on building domestic capabilities, strengthening supply chains and enabling Indian companies to move towards higher value addition.”

Dr Shalu Agarwal, General Manager of India and Head of Power Semiconductor, ISIG, said: 

“Power electronics will play an increasingly important role in enabling technologies ranging from electric mobility and renewable energy to industrial applications and AI data centres. India has a strong opportunity in Silicon Carbide (SiC) and Gallium Nitride (GaN), making investments in design, packaging, testing and reliability capabilities essential.”

The summit is part of ISIG’s 2026 global summit series, connecting semiconductor leaders across key international markets. Reaffirming its commitment to India’s semiconductor ecosystem, ISIG will return to the country for its next edition on 30 November – 1 December 2027.