Articles

Dual-side cooling (DSC) shrinks package footprint by 57% compared with TOLT, packing more power into space-constrained megawatt-scale racks. One of the lowest on resistances in the 650V class, at 20 mΩ in an 8x8 mm package. Single-source path to 800V designs with industry-standard PQFN footprint plus full controller, driver and MCU...

Cape Canaveral, FL - 30 September — Space Forge, the advanced materials company pioneering semiconductor manufacturing in space, today announced that its "Microgravity Semiconductor...

Bangalore - September 30, 2026 – VIAVI Solutions today introduced CyberFlood CF50, the industry’s smallest and lightest all-in-one platform for enterprise-scale application performance, security,...

Ask a question or take a photo: Virtual Assist supports service and maintenance Singapore, September 29, 2026 – ASMPT SMT Solutions, the...

-  TDK and TDK-Lambda will showcase components, power solutions and technologies for next-generation electric vehicles and EV fast-charging infrastructure, October 13–15,...

The new R&S FSWX-KM700 pulse analysis option extends the multi-channel signal and spectrum analyzer, for example, into a workstation for...

Helps OEMs and Tier 1s bring driver and occupant monitoring to high-volume vehicle platforms with lower system cost Delivers 35%...

Monojit Samaddar Hollow Core Fiber (HCF) is rapidly advancing from research labs into field trials and early commercial deployments. By...

At the recent technology demonstration, Allan LAGASCA, Director, Smart Industrials Segment & Robotics Segment Strategic Program at STMicroelectronics, presented a...

This October, Rohde & Schwarz will welcome the wireless community back for the sixth Mobile Test Summit. Under the banner...