October 21, 2026 TDK Corporation (TSE: 6762) has introduced the compact B3201*A5/B5/C5 series of Y1 safety capacitors designed to suppress...

AUSTIN, TX — October 7, 2026 — Microelectronics US today announced the formation of its Steering Committee. Leaders from NVIDIA, AWS, Siemens, GlobalFoundries,...

Cadence AuraStack AI Super Agent and Millennium M2000 AI Supercomputer, powered by NVIDIA Blackwell GPUs and NVIDIA CUDA-X, help Nokia...

The company’s L-Series timing devices are designed to scale between COTS and traditional space-grade solutions, offering shorter lead times at...

Builds on agentic AI capabilities introduced at DAC 2026, extending them to 3D integrated circuits (3D IC) electrothermal codesign Orchestrates...

Up to 600 MHz RXv3e core and high-speed MRAM deliver fast, reliable real-time performance. RX74M supports major industrial networks—including EtherCAT,...

Tessenderlo-Ham, Belgium, 22 October 2026 – Expanding on the industry’s widest sensing portfolio, Melexis introduces the MLX92342, a 2-wire PCB-less...

Munich, Germany – 22 October 2026 – UnternehmerTUM Accelerator, Microsoft, Infineon, and NVIDIA, today launched the Physical AI Growth Lab,...

Bangalore - October 23, 2026 – Inertial Labs, a VIAVI Company, today launched the INS-NV, a programmable development platform that combines inertial navigation system (INS), attitude...

Pioneering the Future of Edge AI, Smart Mobility, and Next-Gen Power Architectures As the global electronics and semiconductor industry races...