For Medium to High Frequency Applications, Low Profile Devices Save Space While Reducing Parasitic Inductance for Cleaner Switching MALVERN, Pa....

News Highlights HPE will be one of the first OEMs to adopt the AMD “Helios” architecture, an open, full-stack AI...

The annual DigiWish contest returns Dec. 1-24, giving engineers, makers and tech enthusiasts a chance to win daily prizes and...

Suchi Semicon has introduced two new semiconductor packaging product lines, QFN Packages and Power Packages, to expand its advanced packaging...

TDK presents new S series inrush current limiters for up to 35 A and 750 J in high-power applications TDK...

Join DigiKey and Hirose for an Informational Webinar on Humanoid Robotics Explore the challenges and solutions in humanoid robotics, from...

December 2, 2025 – Taipei – The wave of innovation driven by generative AI is sweeping the globe, and AI's capabilities...

Augmenting Reliability and Performance in Mission-Critical Energy Infrastructure Applications New 3300V and 2300V SiC products based on latest GeneSiC™ Trench-Assisted...

Klein-Winternheim, Germany – 01 December 2025 – SYSGO, Europe’s leading provider of embedded operating systems for safety- and security-critical applications, is pleased...

Expanding Azure Global Cloud Security Services in Europe Expands Use Cases for Marvell-powered, Cloud-based Security Services in the Region, Adding...