Infineon Cool SiC™ 62 mm module for New SiC Applications
Munich, Germany – 29 June 2020 – Infineon Technologies AG(FSE: IFX / OTCQX: IFNNY) adds another industry standard package to...
Munich, Germany – 29 June 2020 – Infineon Technologies AG(FSE: IFX / OTCQX: IFNNY) adds another industry standard package to...
The 5G wave that’s been building for many years will finally come to shore in 2019. Early (but extremely limited)...
Sound Semiconductor Spins Out Single and Dual VCA Chips VCA Range now spans Single, Dual, and Quad Versions June 23,...
· Second Product Released on Lattice Nexus FPGA Platform in Just Six Months · Enables Industry-leading I/O Count in Small Form Factor...
Oxfordshire, UK June 2020: Direct Insight, the UK-based,technical systems integrator and reseller of system-on-module (SoM) and other embedded systems, has...
Solves capacitance issues in power supply circuits Willich-Münchheide, Germany, June 24, 2020 – ROHM announces the development of Nano Cap™...
Renesas IPS2200 Delivers Total Stray-Field Immunity, Lower Weight, and Cost-Effective Design in a Thin Profile for Industrial Motors. TOKYO, Japan...
Munich, Germany, and El Segundo, California – 23 June 2020 – Reliably attaching surface mount hermetic power packages to PCBs...
MAX32670 saves 40 percent power and 50 percent space, includes ECC-protected memory for increased equipment uptime SAN JOSE, Calif.—June 23, 2020—Reduce...
Siemens acquires UltraSoC to drive design for silicon lifecycle management • Acquisition expands Xcelerator portfolio and creates data-driven product lifecycle...
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