Industry’s First Terabit-Scale Ethernet PHY Enables Highest-Density 400 GbE and FlexE Connectivity
META-DX1 uniquely combines 100 GbE, 400 GbE, FlexE, nanosecond timestamping accuracy and MACsec security engine in a single chip with...
META-DX1 uniquely combines 100 GbE, 400 GbE, FlexE, nanosecond timestamping accuracy and MACsec security engine in a single chip with...
Srengthening and accelerating its path of profitable growth Munich, Germany, and San Jose, California – 3 and 2 June 2019...
Autonomous vehicles – also referred to as self-driving cars – use information captured to safely make the same decisions (braking,...
Nano Dimension, in Collaboration with Harris Corporation, Receives Grant Approval to Develop Hardware that will Fly on the International Space Station NESS...
BANGALORE, India, May 31 2019 ̶ Analog Devices, Inc. (ADI), the industry leader in RF and Microwave technology and system design for...
After two strong years, the sensor and actuator market has cooled off as a result of inventory drawdowns, slowing unit...
- NXP to Pay $1.76 Billion in Cash for Marvell’s Wi-Fi and Bluetooth/BLE Combo Solutions Portfolio - Captures Premium Valuation...
Highly Integrated ISL72814SEH Reduces Command and Telemetry Solution Size by 50 Percent TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a...
Munich, Germany – 29 May 2019 – Infineon Technologies AG launches the XENSIV TM DPS368. The miniaturized digital barometric pressure sensor is...
Built on Qualcomm Snapdragon XR1, the new reference design unveils enhanced features to enrich XR experiences with distributed processing MAY...
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