Infineon’s smart entrance counter solution named as CES 2021 Innovation Awards Honoree
Munich, Germany and Las Vegas, USA – 17 December 2020 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) smart...
Renesas Accelerates R-Car V3U ASIL D SoC
Renesas Accelerates ADAS and Automated Driving Development with Best-in-Class R-Car V3U ASIL D System on Chip Open, Scalable Platform with...
Littelfuse Expands PolySwitch Low Rho SMD Series
Ideal for consumer electronics, mobile, wearable, and portable battery applications Beijing, China, December 16, 2020 —Littelfuse, Inc. (NASDAQ: LFUS), a...
Aledia produces first micro-LED chips on 300mm silicon wafers
Aledia S.A of Echirolles, near Grenoble, France (a developer and manufacturer of 3D micro-LEDs for display applications based on its...
Renesas and FAW Establish Joint Laboratory for Next Generation Automotive
Intelligent Driving Development Platform Collaboration Accelerates Commercialization for FAW’s Smart Vehicles OKYO, Japan, and CHANGCHUN, China ― Renesas Electronics Corporation...
GaN Systems New Half-Bridge Designs Increase Output Power More Than 30%
Latest IMS solutions raise the bar with increased output power and efficiency with high-κ IMS3 thermal designs OTTAWA, Ontario, December...
Pseudospin in antiferromagnets
New perspectives for information technologies A team of researchers from the Technical University of Munich (TUM), the Bavarian Academy of...
Cellular IoT reference design reduces development costs
Ericsson’s ARDESCO, co-developed with Sigma Connectivity, employs Nordic’s nRF9160 SiP and nRF52840 SoC to provide LTE-M, NB-IoT, and Bluetooth LE...
Compact 120 W Power Adapters for Medical and Dental Applications
TUALATIN, Ore. — 15 December 2020 CUI Inc today announced the addition of two 120 watt ac-dc external power supply...
J-Link Remote Debugging Accelerated by SEGGER’s New Server Network
Monheim, Germany – December 16th, 2020 SEGGER announces that it now operates a worldwide network of J-Link Remote Servers, enabling...
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