Multi-access Edge Computing (MEC) platforms provide a versatile, commercial off-the-shelf (COTS) solution that delivers a wide range of network and...

Expansion of SA50-120 family introduces qualified 100V and 120V bus systems for space applications New Delhi, February 24, 2021 –...

ROHM has developed a new Wi-SUN FAN (Field Area Network) module for infrastructure applications, capable of connecting up to 1,000...

Jointly-Developed Open Camera Platform Significantly Shortens Time to Mass Production of Euro NCAP, C-NCAP, and L2+ Applications TOKYO, Japan and...

Anritsu Corporation is pleased to announce that the first EPS-FB Protocol Conformance test for 5G NR has been verified on...

Qualcomm Technologies, Inc. introduces its first augmented reality (AR) reference design based on the Qualcomm® Snapdragon™ XR1 Platform, equipped to...

Space-saving LFPAK56D half-bridge offers 60 % lower parasitic inductance and improved thermal performance for power train, motor control and DC/DC...

Hoofddorp, Netherlands: Murata announces the introduction of a 6-DoF (Degrees of Freedom) MEMS-based XYZ-axis inertial sensor for high-precision machine control...

5G Roll-outs More Than Tripled in 2020 to Reach 1,336 Cities Worldwide, According to VIAVI Report Scottsdale, Ariz., February 23,...

As companies compete to release the best new electronic devices, differentiation from the competition comes from the different features and...