TOKYO, May 9, 2019 -  Sharp Corporation announces it agreed to establish a new form of partnership with Hisense International...

Semiconductors are a group of materials having electrical conductivity intermediate between metals and insulators. It is significant that the conductivity...

MAY 7, 2019 Expansion to generate up to a 30-fold increase in SiC wafer fabrication capacity and 30-fold increase in...

Small footprint surface mount components facilitate production process & aid servicing Portsmouth, UK, 8 May 2018 - Covering a surface...

A tiny, portable radar device could allow visually impaired people, or unmanned moving devices, to detect objects in real time....

Nijmegen, The Netherlands – 8th May 2019, Ampleon has released the first of a family of RF power devices based...

•       Encapsulated 1 x 1in package now delivers single outputs up to 30W, and dual outputs up to...

HONG KONG — Artesyn Embedded Technologies today announced a new three-slot 50 volt/12 kilowatt module for its iHP Digital Configurable...

What do developers need to know about Current Sensing Technology – All about AMR Based Current Sensing For Server Farm...

Munich, Germany – 7 May 2019 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is extending the CoolSiC™ Schottky...