New flexible, space-saving power solution for industrial and medical applications eliminates need for custom development to speed time-to-market DENVER, Colo.,...

December 11, 2025 TDK Corporation (TSE:6762) expands its B409x series of SMD hybrid polymer aluminum electrolytic capacitors with a design...

Tessenderlo-Ham, Belgium, 11 December 2025 – Melexis unveils the MLX90296, a new micropower linear Hall-effect sensor that draws less than...

08/12/2025 Ensuring Reliable Voice Communication for NG eCall and Faster Emergency Response ANRITSU CORPORATION today announced the launch of an...

New Dual-Band Solutions Support 2.4GHz and 5GHz on Renesas’ Low-Power RA MCU Architecture TOKYO, Japan, December 10, 2025 ― Renesas...

Enabling Next-Generation Applications with High-Speed Interface Testing up to 80 Gbit/s 12/11/2025 ANRITSU CORPORATION announces that its test solution for...

IndieSemiC and C-DAC Trivendrum signed an MoU to collaborate on semiconductor and embedded system development. Joint development of an AI...

Device Combines High B25/85 Value of 4311 K With R25 Value of 100 kΩ and Tolerances Down to ± 1...

Leading LPWAN Technology Achieves 25% CAGR Across Deployments; LoRa Alliance will showcase the technology at CES 2026 Fremont, Calif. –...

Family includes 608 A half-bridge module with 2.4 mΩ RDSon and best-in-class thermal resistance December 10th, 2025, Lake Forest, CA...