Monheim am Rhein, Germany – October 4th, 2023 SEGGER's J-Link PRO PoE, a new member of the J-Link family, with...

Joint collaboration on SiC modules brings the next step in module compactness and maximum power density Nijmegen, October 4, 2023:...

Double space saving with integrated BJTs and resistors in ultra compact DFN2020(D)-6 packaging Nijmegen, September 27, 2023: Nexperia, the essential...

Infineon's security solutions support the industry, the consumer, and the environment alike Sep 25, 2023 | Business & Financial Press...

The Ultrahuman Ring Air employs Nordic’s nRF52840 SoC to oversee heart rate, movement, and temperature sensors Fitness technology company Ultrahuman...

Munich, Germany – 22 September, 2023 – In many sectors, conventional keys are fast becoming obsolete, a development that has...

Enables Designers to Share Data Between Embedded and AI/ML Projects, Streamlining the Creation of Edge and Endpoint AI Applications TOKYO,...

Greenhouse Gas Emission Roadmap demonstrates commitment to Sustainability and Innovation Nijmegen, September 19, 2023: Nexperia is a rapidly growing global...

Munich, Germany, and Shenzhen, China – 20 September, 2023 – Power semiconductors based on silicon carbide (SiC) offer several advantages,...

Proven by the standardized EEMBC ULPMark-CM benchmarking, the processing efficiency of the nRF54H20's application processor outclasses competing general-purpose MCUs and...