Way ahead of the final ratification of the IEEE standard, Rohde & Schwarz has implemented first Wi-Fi 8 RF tests...

India’s semiconductor ambitions received a significant push with the foundation of a ₹3,700-crore chip assembly and test facility in Uttar...

NanoXplore’s NG-ULTRA FPGA becomes the first product qualified to new European ESCC 9030 standard for space applications The product leverages...

Collaboration supports the nation’s “Make in India” initiative and global priority for supply chain diversification  Companies’ manufacturing partnership aimed at...

Rohde & Schwarz has expanded the capabilities of its CMX500 radio communication tester to cover all non-terrestrial network (NTN) technologies,...

Harwin has launched an online 3D virtual showroom for its high-reliability product ranges (HRi). It is designed to improve how...

February 19, 2026  TDK Corporation (TSE: 6762) introduces the new B43655 and B43656 series of aluminum electrolytic capacitors designed specifically for...

Siemens’ Innovator3D IC software recognized for advancing 2.5D and 3D chiplet integration Siemens has won in the “Packaging: Design” category...

Hoofddorp, Netherlands, February 2026: Murata Manufacturing Co., Ltd. expands the ZENCROSSTM Alliance ecosystem with the addition of qualified engineering and development service...

FANUC India’s V Sriram Kumar appointed CEO; Hical’s Executive Chairperson Sujaya Shashikiran takes over as President Establishment of Electronics Centre...