Featuring a Low 0.88 mm Profile and Wettable Flanks, Unidirectional and Bidirectional Devices Save Space and Provide Excellent Clamping Capability...

TDK Corporation (TSE: 6762) announces the launch of the TDK‑Lambda i9C series, a 1500 W non‑isolated DC‑DC buck‑boost power module...

San Jose, CA, May 13, 2026 – Synaptics® Incorporated (Nasdaq: SYNA) announced its plans for COMPUTEX Taipei 2026, June 2–5, at the Taipei Nangang...

NI Nigel™ AI to expand into code generation and cross-platform intelligence, embedding AI automation across the test lifecycle FORT WORTH,...

Next‑Generation 100/1000BASE‑T1 Single Pair Ethernet PHYs Integrate MACsec Security, Time Sensitive Networking and Functional Safety     National, 13th May 2026: As...

New AI-powered characterizer. accelerates .lib generation from weeks to days and delivers 7x greater throughput Characterizer AI engine and advanced Liberty Variation Format...

Streamlined access to advanced electronic design automation (EDA) software for European semiconductor innovation Lowers barrier for smaller companies, startups and...

Bengaluru, 12th May 2026: Manipal Institute of Technology (MIT), Bengaluru, a constituent unit of the Manipal Academy of Higher Education...

New gold-plated, washable DIP switches enable high-density PCB layouts in space-constrained designs ROSEMONT, Ill., April 21, 2026 — Littelfuse, Inc....

Munich, Germany – May 12, 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) announced a collaboration with d-Matrix®,...