TDK recognized as leader and awarded an A ranking in the CDP Supplier Engagement Rating for the fifth consecutive year
TDK was recognized as a leader in the CDP Supplier Engagement Rating 2024 for the fifth consecutive year A ranking...
RANsemi Launches Plug-and-Play Baseband Board for Split 7.2 Open RAN Radio Units
Powered by RANsemi’s RU baseband SoC and TI’s 5G transceiver, RNS805-RU-BB delivers full-band 5G/4G flexibility and neutral host capability with...
Murata to Showcase ADAS, xEV and Connectivity Solutions at IAA MOBILITY 2025 this September
Hoofddorp, Netherlands, July 2025: Murata Manufacturing Co., Ltd is set to present its latest advancements in automotive technology and connected solutions at IAA MOBILITY in...
Nexperia brings the benefits of clip-bonded FlatPower packaging to bipolar junction transistors
CFP15B package offers a compact and cost-efficient alternative to MJD series in DPAK package Nijmegen, July 16, 2025: Nexperia today...
TDK announces launch of TDK SensEI’s edgeRX Vision
TDK has unveiled the latest TDK SensEI product line, edgeRX Vision, an ultra-fast, AI-powered defect detection system that analyzes customer...
Power Integrations Names Jennifer Lloyd as Its Next CEO
Analog industry veteran to succeed longtime leader Balu Balakrishnan SAN JOSÉ, CALIF. – July 15, 2025 – Power Integrations (Nasdaq: POWI), the...
New trade show to promote innovation in UK microelectronics, embedded systems and optoelectronics engineering
· Microelectronics UK exhibition to open at Excel London on 24-25 September 2025 with keynote speech from UK government innovation...
Aerial-Ground Surveillance Robot Using Arduino and Quadcopter Integration
This project presents a hybrid surveillance system that combines a two-wheel drive (2WD) land vehicle with a quadcopter drone for...
SEMI and India Semiconductor Mission (ISM) Announce the Opening of Visitor Registrations for SEMICON® India 2025
Event to Showcase Global Semiconductor Trends and India's Local Ecosystem Development National, July, 2025: Visitor registration for SEMICON India 2025, scheduled to...
New QSMP-25 solder-down module features next-gen STM32 MPU to enable secure edge AI in Industry 4.0 applications
QFN-style 29mm2 SoM offers dual ARM Cortex-A35, NPU, VPU, GPU & PCIe to combine intelligent edge processing with high-end multimedia...
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