A collaboration with Dimension NXG leverages the efficiency of Ambient Scientific’s GPX-10 processor to bring offline, privacy-focused safety and health...

New power modules with proprietary IsoShield™ technology deliver industry-leading power density News highlights: IsoShield technology enables isolated power modules with...

GaN-Based HWLLC Converter Topology Sets New Power Density and Peak Efficiency Benchmarks for Next-Generation Computing Devices, Power Tools and e-Bikes...

First-of-its-kind bidirectional GaN technology with DC blocking dramatically reduces switch count needed for power conversion topologies Compatible with standard gate drivers Soft- and...

Half-bridge series for data center cooling and industrial drivers includes 1, 1.4 and 2 mΩ RDSon SiC MOSFETs and parallel SiC...

In a candid conversation with Vaishali, Editor of Semiconductor For You, Mr.  Sanjay Gupta, India Country Head & Chief Development...

The BZPACK mSiC power modules leverage Microchip’s advanced mSiC technology, incorporating performance of its MB and MC SiC MOSFET families...

Authors: Volodymyr Ilchuk, Team Lead, Application Engineering and Irena Zhuravchak, Application Engineer, Lviv, Renesas, Ukraine This article focuses on the...

Infineon's advanced wide-bandgap semiconductors and microcontroller platforms to support Zenergize in building cutting-edge solar inverters, EV fast chargers, and energy-storage...

March 17, 2026 TDK Corporation (TSE:6762) introduces the TDK-Lambda i1R ORing FET modules, capable of operating at 60 or 80...