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Home Semiconductor News

BluGlass’ upgraded BLG-300 chamber demonstrates targeted thickness uniformity for LED wafers up to 6”

Semiconductor For You by Semiconductor For You
September 18, 2017
in Semiconductor News
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BluGlass Ltd of Silverwater, Australia says that its upgraded BLG-300 chamber has demonstrated RPCVD deposition uniformity within its targets for LED wafers, up to 6-inch in size.

BluGlass is commercializing its proprietary low-temperature remote-plasma chemical vapor deposition (RPCVD) process for manufacturing indium gallium nitride (InGaN)-based LEDs, power electronics and solar cells, offering advantages including higher performance and lower cost, it is claimed.

The upgraded BLG-300 (the firm’s larger RPCVD platform) is now producing thickness uniformity of <3% variance over 2- and 4-inch wafers and <3.5% variance over a single 6-inch wafer, meeting BluGlass’ targets to progress on the commercialization projects. The upgraded chamber (a scaled-up version of the BLG-180 design) has also produced LED efficiency on par with the firm’s previous best results as BluGlass works to deliver industry acceptance of RPCVD technology.

The improved BLG-300 has also delivered LED performance uniformity (critical benchmarks for demonstrating the commercial application of the firm’s unique low-temperature technology, BluGlass reckons).

“The new chamber design has been highly successful in a number of key areas for BluGlass,” comments managing director Giles Bourne. “The thickness and performance uniformity have now been demonstrated, and by applying the identical design from the BLG-180 to the larger BLG-300, we have also shown that RPCVD can be scaled in size and for the deposition of larger wafers,” he adds. “All of this is substantial progress for the RPCVD technology and our commercialization efforts.”

The BLG-300 has now been re-deployed on the development of the firm’s industry evaluations with Lumileds, IQE and others, all of which are expected to benefit from the improved uniformity and larger-wafer deposition capability.

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