Norstel completes 150mm SiC n-type wafer development
Norstel AB of Norrköping, Sweden has developed low-defect-density 150mm silicon carbide (SiC) n-type substrates. Norstel manufactures conductive (n-type) and semi-insulating...
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100G Lambda MSA to define specification for next-generation optical links
The 100G Lambda Multi-Source Agreement (MSA) Group has announced their intent to develop specifications based on 100Gbps per wavelength optical...
Evatec expanding Greater China operations to support rapid business growth
Evatec Ltd of Trübbach, Switzerland (which makes thin-film deposition and etch processing equipment for advanced packaging, power device, MEMS, optoelectronics,...
InnovateUK awards £1.1m to SUPER8 project to develop 200G 8-channel CWDM transceiver for hyper-scale cloud data-centers
The Compound Semiconductor Centre (CSC) - a joint venture between Cardiff University and epiwafer foundry and substrate maker IQE plc...
BluGlass’ upgraded BLG-300 chamber demonstrates targeted thickness uniformity for LED wafers up to 6”
BluGlass Ltd of Silverwater, Australia says that its upgraded BLG-300 chamber has demonstrated RPCVD deposition uniformity within its targets for...
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