Harwin Launches Interactive 3D Virtual Showroom with Augmented Reality Viewer for High Reliability Ranges
Harwin has launched an online 3D virtual showroom for its high-reliability product ranges (HRi). It is designed to improve how...
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TDK introduces two new DC link capacitor series optimized for on-board chargers in electric vehicles
February 19, 2026 TDK Corporation (TSE: 6762) introduces the new B43655 and B43656 series of aluminum electrolytic capacitors designed specifically for...
Siemens wins Best of Show Award for “Packaging: Design” at 2026 Chiplet Summit
Siemens’ Innovator3D IC software recognized for advancing 2.5D and 3D chiplet integration Siemens has won in the “Packaging: Design” category...
Murata expands ZENCROSSTM Alliance IoT ecosystem with new engineering and development service partners
Hoofddorp, Netherlands, February 2026: Murata Manufacturing Co., Ltd. expands the ZENCROSSTM Alliance ecosystem with the addition of qualified engineering and development service...
ELCIA Appoints New Leadership Team to Boost Electronics and Semiconductor Ecosystem Growth
FANUC India’s V Sriram Kumar appointed CEO; Hical’s Executive Chairperson Sujaya Shashikiran takes over as President Establishment of Electronics Centre...
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