Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era
Scalability and functional safety enabled by chiplet technology Auto-grade quality for large, modern AI NPUs Advanced power control for higher...
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Renesas Develops 3nm TCAM Technology Combining High Memory Density and Low Power, Suitable for Automotive SoCs
Achieves flexible, small-block configuration for large-scale TCAMs Cuts search energy and boosts speed through efficient search processing Enhanced functional safety...
VIAVI to Showcase Test Solutions across Security, Quantum-safe, AIOps, AI data center, 6G and AI-RAN at MWC Barcelona
Bangalore - Feb 19, 2026 - VIAVI Solutions has announced its demonstration lineup for Mobile World Congress (MWC) Barcelona 2026, which takes place March...
GlobalFoundries and Renesas Expand Partnership to Accelerate U.S. Semiconductor Manufacturing
Multi‑billion-dollar collaboration strengthens supply chain resiliency and supports growing demand for chips powering smart vehicles and next-generation industrial systems MALTA,...
Vishay Intertechnology AEC-Q200 Qualified Thick Film Chip Resistors Feature Ultra Compact 0201 Case Size
Devices Save Space While Maintaining High Reliability in Automotive, Industrial, and Telecommunications Applications MALVERN, Pa. — Feb. 18, 2026 — Vishay...
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