Infineon’s AIROC™ Wi-Fi/Bluetooth® solutions now available with NVIDIA Jetson Edge AI platform
Munich, Germany – 27 May, 2022 – Artificial intelligence (AI) at the edge will tremendously impact a number of industry...
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MediaTek Announces World’s First Complete Wi-Fi 7 Platforms for Access Points and Clients
Filogic 880 and Filogic 380 will drive the next generation of connectivity with the fastest and most reliable Wi-Fi 7...
MediaTek Launches First mmWave Chipset for Seamless 5G Smartphone Connectivity
Dimensity 1050 mmWave SoC highlights trio of new chipsets expanding MediaTek’s 5G and gaming portfolio HSINCHU, Taiwan – May 23,...
Qualcomm Cuts the Cord with the New Wireless AR Smart Viewer Reference Design
The Reference Design Enables OEMs to Build the Next Generation of Untethered Augmented Reality (AR) to Enable Immersive Experiences that...
UTAC Announces New High Output Copper Clip DFN for Discrete MOSFETs in Ultra High Density (UHD) Leadframes
UTAC Holdings Ltd. (UTAC), a global semiconductor test and assembly services provider, is announcing a punch copper (Cu) clip packaging...
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