Avnet Silica to showcase innovative AI / ML technologies at embedded world
Featuring AI at the edge capabilities, in partnership with leading manufacturers Brussels, Belgium, 16 May 2022– Avnet Silica, an Avnet...
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Infineon expands Prime Switch family with ultra-reliable Press Pack IGBT
For transmission and distribution applications and medium voltage drives Munich, Germany – 16 May, 2022 – Infineon Technologies Bipolar GmbH...
Nexperia further expands its offering of Clip-bonded FlatPower packaged diodes with new automotive CFP2-HP devices
Driving the transition in product packaging by investing in capacity and portfolio Nijmegen, May 16, 2022: Nexperia, the expert in...
Trackwise delivers space- and weight-saving flexible printed circuit cell-connecting interconnect for cell-to-pack EV batteries
New UK facility being built to deliver lightweight, convenient and space-saving flexible printed circuit technology in high volume to EV...
Nexperia launches new portfolio of application specific MOSFETs (ASFETs) for automotive airbags
Provides excellent transient linear mode performance using new SOA trench technology in LFPAK packaging providing designers with a smaller and...
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