E-PEAS Uses CES to Unveil Groundbreaking MCU Supporting Low Power Demands of Edge Processing
5th January 2022 – Through its AEM family, e-peas has already established itself as a technology leader in the development...
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congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors
San Diego, Las Vegas/USA, 4 January 2022: congatec – a leading vendor of embedded and edge computing technology – introduces...
Infineon and Deeyook jointly enable precise location solution with low-power Wi-Fi chipset
Munich, Germany, and Tel Aviv, Israel – 5 January, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and...
Infineon’s new generation of AURIX™ microcontrollers accelerates electrification and digitalization of the car
Munich, Germany, and Las Vegas, Nevada, USA – 5 January 2021 – The future of mobility will be carbon-neutral, autonomous,...
Infineon further strengthens leading position as automotive semiconductor supplier with next-generation AURIX™ TC4x
Munich, Germany – 5 January, 2022 – As the global market leader in automotive semiconductors, Infineon Technologies AG (FSE: IFX...
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