Nexperia receives Bosch Global Supplier Award for the second time in a row
The prestigious award for ‘Purchasing of direct materials – Mobility Solutions’ recognizes Nexperia’s collaborative partnership with Bosch Nijmegen, August 5,...
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GaN Systems and ON Semiconductor Partner to Deliver Smaller, More Efficient, Lower Cost Power Solutions
Companies Introduce World’s First Bridgeless Totem Pole PFC Evaluation Board OTTAWA, Ontario, August 5, 2021 – GaN Systems, the global...
Extruded heat sink materials – Aluminum alloys vs copper
Heat sinks are most important components of electrical devices, they are used in everything be it any lighting equipment or...
Nexperia’s new Application-Specific MOSFETs (ASFETs) for hot-swap increase SOA by 166% and slash PCB footprint by 80%
New 80V & 100V devices minimize derating and improve current sharing for optimum performance, high reliability and reduced system cost...
New Highly Integrated Renesas PMIC Optimized For RZ/G2L And V2L MPUs Delivers Complete Power Solution To Reduce Design Time
New Device Increases System Reliability; Supports Low-Cost, Four-Layer PCB Boards August 5, 2021 TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723),...
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