STMicroelectronics Extends MasterGaN® Family with New Device Optimized for Asymmetrical Topologies
January 28, 2021: Building upon the advantages of STMicroelectronics’ MasterGaN® platform, MasterGaN2 is the first in the new family to...
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u-blox ALEX-R5 integrates cellular and GNSS technology into a miniature SiP form factor with zero compromises
The SiP features the secure u-blox UBX-R5 LTE-M / NB-IoT chipset and the u-blox M8 GNSS chip for size-constrained asset...
XP Power announces Pan-European distribution agreement with Distrelec
January 26th, 2021 – XP Power has signed a Pan-European distribution agreement with Distrelec. The new partnership will allow the...
24 V dual-channel low side EiceDRIVER™ with enable function and integrated thermal pad
Munich, Germany – 25. January 2021 – Infineon Technologies AG (FSE: IFX / QTCQX: IFNNY) broadens its EiceDRIVER™ portfolio with...
SEGGER’s J-Link OB plays crucial role in new BBC ‘HiFive Inventor’ educational kit
Monheim am Rhein, Germany – 21st January 2021 SEGGER's J-Link on-board debug probes can be found on hundreds of different...
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