Fujitsu Develops Nanotube Adhesive Sheet Technology with High Thermal Conductivity
Thermal conductivity three times higher than conventional materials, enabling practical use as a heat dissipation material News Facts:- Fujitsu Laboratories...
Thermal conductivity three times higher than conventional materials, enabling practical use as a heat dissipation material News Facts:- Fujitsu Laboratories...
TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced a new open-source ventilator system...
SAN JOSE, Calif., April 15, 2020 – Xilinx, Inc. (NASDAQ: XLNX), the leader in adaptive and intelligent computing, today announced that...
Qualcomm Technologies, Inc. and BOE Technology Group Co., Ltd., a global leader in the semiconductor display industry, announce their plans...
April 13, 2020 - The STUSB4500L from STMicroelectronics is a small-footprint addition to the Company’s USB-C controller IC family designed and certified for pure 5V sink-only...
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