Semiconductor News HARMAN Embedded Audio Showcases Connected Device Innovation at Mobile World Congress 2026 February 25, 2026
Semiconductor News Teledyne FLIR OEM Launches Lepton XDS at Mobile World Congress; A Compact Thermal‑Visible Camera Module Featuring Patented MSX Technology February 25, 2026
Semiconductor News VIAVI announces DCX 700 tier 1 optical loss test set for testing up to 24 fibers February 25, 2026
Semiconductor News Rohde & Schwarz advances AI-RAN testing using digital twins with NVIDIA February 24, 2026
Semiconductor News duagon supplies embedded hardware for the train servers of the new Munich S-Bahn from Siemens Mobility February 24, 2026
Semiconductor News Infineon presents microcontroller and sensor solutions for the future of AI, IoT, mobility, and robotics at embedded world 2026 February 24, 2026
Semiconductor News Synaptics to Showcase Edge AI and Advanced Wireless Innovation at Embedded World 2026 February 24, 2026
Semiconductor News Rohde & Schwarz and Broadcom showcase first Wi-Fi 8 RF signaling tests, paving way for next-gen connectivity February 23, 2026