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Samtec interconnects selected to improve signal integrity and reduce SWaP of evolving VITA standards requiring miniaturization and functionality advancements. VITA™ 90...

HARMAN Embedded Audio Showcases Connected Device Innovation at Mobile World Congress 2026

BARCELONA — Feb. 24, 2026 — HARMAN Embedded Audio (HEA), a leading end‑to‑end B2B embedded audio solutions provider, announced it will showcase...

Teledyne FLIR OEM Launches Lepton XDS at Mobile World Congress; A Compact Thermal‑Visible Camera Module Featuring Patented MSX Technology

Prism™ ISP–Powered Dual Camera Module Delivers Enhanced Performance and Faster Integration for OEMs BARCELONA and GOLETA, Calif.,– Teledyne FLIR OEM, a...

VIAVI announces DCX 700 tier 1 optical loss test set for testing up to 24 fibers

Bangalore - February 25, 2026 – VIAVI Solutions has announced the DCX 700 tier 1 optical loss test set for testing up to...

Rohde & Schwarz advances AI-RAN testing using digital twins with NVIDIA

Rohde & Schwarz, in collaboration with NVIDIA, continues to drive AI-RAN innovation for 5G-Advanced and 6G. The latest testbed to...

Renesas R-Car V4H ADAS SoC Selected for Toyota RAV4 Model

Renesas ADAS automotive SoC, R-Car V4H has been selected for the TSS(LSS) control unit supplied by Denso for Toyota’s new...

duagon supplies embedded hardware for the train servers of the new Munich S-Bahn from Siemens Mobility

The new Munich S-Bahn trains are set to be the most modern in Germany – more digital, more connected, and...

Infineon presents microcontroller and sensor solutions for the future of AI, IoT, mobility, and robotics at embedded world 2026

Munich, Germany – 24 February 2026 – Next-generation embedded systems are essential for applications in the rapidly evolving connected world....

Synaptics to Showcase Edge AI and Advanced Wireless Innovation at Embedded World 2026