Infineon Strengthens AI Data Centers with Next-Gen Battery Backup Unit (BBU) Technology
Next-generation Battery Backup Units for AI data centers underscore Infineon's commitment to setting new standards in powering AI Roadmap includes...
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Everspin Expands High-Reliability MRAM Portfolio with New Automotive-Grade Offerings
New PERSYST EM064LX and EM128LX HR STT-MRAM Expanding Use in Aerospace, Automotive, and Industrial Applications Unveiled at Embedded World 2025...
AMI and congatec Celebrate 20 Years of Successful Partnership
Atlanta, USA / San Diego, CA, March 11, 2025 * * * AMI®, the global leader in Dynamic Firmware for worldwide computing, and...
congatec heat pipe cooling solution for extreme environmental conditions
COMs just got even cooler San Diego, CA, March 11, 2025 * * * congatec – a leading provider of embedded and...
congatec presents new COM Express Compact module
Unrivaled AI performance for COMs with Intel Core Ultra processors San Diego, CA, March 11, 2025 * * * congatec –...
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