ROHM has developed a new Wi-SUN FAN (Field Area Network) module for infrastructure applications, capable of connecting up to 1,000...

Jointly-Developed Open Camera Platform Significantly Shortens Time to Mass Production of Euro NCAP, C-NCAP, and L2+ Applications TOKYO, Japan and...

Anritsu Corporation is pleased to announce that the first EPS-FB Protocol Conformance test for 5G NR has been verified on...

Qualcomm Technologies, Inc. introduces its first augmented reality (AR) reference design based on the Qualcomm® Snapdragon™ XR1 Platform, equipped to...

Space-saving LFPAK56D half-bridge offers 60 % lower parasitic inductance and improved thermal performance for power train, motor control and DC/DC...