Recogni Raises $48.9 Million Series BInvestment Led by WRVI Capital
Mayfield Fund, Continental, Robert Bosch Venture Capital, and Existing Investors Join WRVI Capital in Financing Developer of Highest-Performing Power-Efficient Perception...
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GeneSiC’s New 3rd Generation SiC MOSFETs Featuring the Industry’s Best Figure-of-Merits
DULLES, VA, February 12, 2020 — GeneSiC Semiconductor’s next-generation 1200V G3R™SiC MOSFETs with RDS(ON) levels ranging from 20 mΩ to...
Candera, next system and DATA MODUL to present innovative haptic User Interface at Embedded World 2021
Linz/Vienna/Munich - 16/02/2021 –Candera, a leading provider of HMI design tools, next system, a renowned expert of customized haptic hardware...
Rutronik UK stocks Insight SiP Bluetooth 5.1 module for long-distance and direction-finding connections
Manchester, UK – 17 February 2021 – Rutronik UK is now stocking the Insight SiP ISP1907 series of Bluetooth Low...
Apple M1-Optimized Build of SEGGER Embedded Studio Now Available
Monheim am Rhein, Germany – 15th February 2021 SEGGER announces its Embedded Studio build for the newly released Apple M1,...
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