Aledia produces first micro-LED chips on 300mm silicon wafers
Aledia S.A of Echirolles, near Grenoble, France (a developer and manufacturer of 3D micro-LEDs for display applications based on its...
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Renesas and FAW Establish Joint Laboratory for Next Generation Automotive
Intelligent Driving Development Platform Collaboration Accelerates Commercialization for FAW’s Smart Vehicles OKYO, Japan, and CHANGCHUN, China ― Renesas Electronics Corporation...
GaN Systems New Half-Bridge Designs Increase Output Power More Than 30%
Latest IMS solutions raise the bar with increased output power and efficiency with high-κ IMS3 thermal designs OTTAWA, Ontario, December...
Pseudospin in antiferromagnets
New perspectives for information technologies A team of researchers from the Technical University of Munich (TUM), the Bavarian Academy of...
Cellular IoT reference design reduces development costs
Ericsson’s ARDESCO, co-developed with Sigma Connectivity, employs Nordic’s nRF9160 SiP and nRF52840 SoC to provide LTE-M, NB-IoT, and Bluetooth LE...
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