SMART Announces Successful Way to Commercially Manufacture Novel Integrated Silicon III-V Chips
MIT’s Research Enterprise in Singapore has developed a commercially viable way to create new Silicon III-V Chips, paving the way...
Latest News
Rutronik and AP Memory Sign Global Distribution Agreement
Alex de la Bastie, Business Development Director at AP Memory Manchester, UK – 25 September 2019 – Rutronik Elektronische Bauelemente GmbH...
New Lattice CrossLinkPlus FPGAs
Accelerate and Enhance Video Bridging for World-class MIPI-based Embedded Vision Systems CrossLinkPlus family combines FPGA flexibility with instant-on panel display...
Vishay Intertechnology Sensor Modules Offer Long Range Presence and Proximity Sensing
Available in Five Compact Packages, Devices Feature Fast 300 μs Reaction Time and High Interference Strength Without Spurious Signals MALVERN,...
NI Accelerates Cellular Vehicle-to-Everything (C-V2X) Communication to Help Develop Safer Cars
New software-defined C-V2X solution is a cost effective entry point and adaptable to 5G C-V2X AUSTIN, Texas – Sept. 24,...
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