Semiconductor News
Semiconductor For You brings you the latest semiconductor news from around the world, whether it's the latest advances in electronic or semiconductor components.
Melexis Strengthens Commitment to China with New Wholly Foreign-Owned Enterprise (WFOE) and Autonomous Regional Organization
Tessenderlo-Ham, Belgium – 12 March 2026 – Melexis (Euronext Brussels: MELE), a global leader in micro-electronic semiconductor solutions, today announced the formal establishment...
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VIAVI Launches TestCenter D2 1.6T Appliance to Accelerate AI Infrastructure Rollouts
Bangalore - March 13, 2026 – VIAVI Solutions has announced the launch of its next-generation TestCenter D2 1.6T Appliance designed to help cloud...
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Qualitas Semiconductor Selects Anritsu’s Vector Network Analyzer for High-Speed Interconnect Signal Integrity Verification
ANRITSU CORPORATION is pleased to announce that Qualitas Semiconductor Co., Ltd. (hereinafter “Qualitas”), a leading developer specializing in PHY IP...
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Ayar Labs and Wiwynn Partner to Bring Co-Packaged Optics to Rack-Scale AI Systems
Collaboration moves CPO beyond component-level innovation and into deployable AI infrastructure for hyperscale workloads SAN JOSE, Calif., and TAIPEI, Taiwan...
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Advanced Energy Launches LPP200 Series of Low-Profile AC-DC Supplies for Miniaturization of Medical and Industrial Devices
Safety certified power supplies with leading power density and 0.75-inch profile DENVER, Colo., March 11, 2026 — Advanced Energy Industries, Inc....
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Our strength is in-stock availability, localization, and customer-centric service
Tony Ng, Vice President for APAC, DigiKey As surging global demand for electronics fuels growth in industrial automation, robotics, EVs,...
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STMicroelectronics enters high-volume production of its industry-leading silicon photonics platform to support AI infrastructure demand
PIC100 technology in 300 mm high-volume production for leading hyperscalers, with plans to quadruple capacity by 2027 and further expand...
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Navitas Adds Top-Side Cooled QDPAK and Low-Profile TO-247-4L to its Package Line-Up in the Latest 5th Generation GeneSiC™ Technology
QDPAK and Low-profile TO247 in the latest GeneSiC™ 5th Generation Trench-Assisted Planar SiC MOSFET technology deliver significant improvements in performance and...
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OpenLight to Showcase Breakthrough III-V Heterogenous Integrated Silicon Photonics Innovations and Production Capabilities for AI, Cloud, and High‑Speed Networking at OFC 2026
SANTA CLARA, Calif. OpenLight, a leader in heterogeneous III‑V silicon photonic integration and custom Photonic Application‑Specific Integrated Circuits (PASICs), will...
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Renesas Announces General Availability of Renesas 365
First open end-to-end electronics development platform unites device exploration, model-based system development, device lifecycle management and early concept validation in...
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