Expansion of research & development (R&D) and production capacities for future technologies Hamburg, June 27, 2024: Semiconductor manufacturer Nexperia today...
Read moreRoX SDV Platform Combines Hardware, Out-of-Box Software and Cloud-Native AI Development Environment for ADAS, IVI and Gateway Systems TOKYO, Japan,...
Read more17th June 2024 Maldon, Essex, UK – CML Micro has announced the launch of a Ka-band gallium nitride (GaN) power...
Read moreNew Hyde Park, NY… Faster data transfer speeds, increased power transmission and smaller PCB footprints are key advantages of the...
Read moreThree-year Memorandum of Understanding Supports India's Domestic Technology Growth Strategy While Expanding Renesas' Presence in the Country's Chip Sector TOKYO,...
Read moreST's third generation SiC MOSFETs help increase the powertrain efficiency for Geely Auto Group battery electric vehicles. Innovation Joint...
Read morePlano, Texas – May 28, 2024 – Diodes Incorporated (Nasdaq: DIOD) has announced the expansion of its highly successful DML30xx...
Read moreNijmegen, The Netherlands, 28.05.2024 - ITEC introduces the ADAT3 XF TwinRevolve flip-chip die bonder, which runs five times faster than...
Read moreArtificial intelligence leads to increasing energy demand of data centers worldwide Infineon’s new Power Supply Units (PSU) strengthen its leading...
Read more20th May 2024 Maldon, Essex - 20 May 2024 - CML Micro has today announced the global availability of the...
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