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HARMAN Embedded Audio Showcases Connected Device Innovation at Mobile World Congress 2026
BARCELONA — Feb. 24, 2026 — HARMAN Embedded Audio (HEA), a leading end‑to‑end B2B embedded audio solutions provider, announced it will showcase...
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Teledyne FLIR OEM Launches Lepton XDS at Mobile World Congress; A Compact Thermal‑Visible Camera Module Featuring Patented MSX Technology
Prism™ ISP–Powered Dual Camera Module Delivers Enhanced Performance and Faster Integration for OEMs BARCELONA and GOLETA, Calif.,– Teledyne FLIR OEM, a...
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VIAVI announces DCX 700 tier 1 optical loss test set for testing up to 24 fibers
Bangalore - February 25, 2026 – VIAVI Solutions has announced the DCX 700 tier 1 optical loss test set for testing up to...
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Rohde & Schwarz advances AI-RAN testing using digital twins with NVIDIA
Rohde & Schwarz, in collaboration with NVIDIA, continues to drive AI-RAN innovation for 5G-Advanced and 6G. The latest testbed to...
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Renesas R-Car V4H ADAS SoC Selected for Toyota RAV4 Model
Renesas ADAS automotive SoC, R-Car V4H has been selected for the TSS(LSS) control unit supplied by Denso for Toyota’s new...
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duagon supplies embedded hardware for the train servers of the new Munich S-Bahn from Siemens Mobility
The new Munich S-Bahn trains are set to be the most modern in Germany – more digital, more connected, and...
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Infineon presents microcontroller and sensor solutions for the future of AI, IoT, mobility, and robotics at embedded world 2026
Munich, Germany – 24 February 2026 – Next-generation embedded systems are essential for applications in the rapidly evolving connected world....
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Synaptics to Showcase Edge AI and Advanced Wireless Innovation at Embedded World 2026
NUREMBERG, Germany, February 24, 2026 – Synaptics® Incorporated (Nasdaq: SYNA) today announced their presence at Embedded World 2026, March 10–12 in Nuremberg, Germany, where they will...
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Rohde & Schwarz and Broadcom showcase first Wi-Fi 8 RF signaling tests, paving way for next-gen connectivity
Way ahead of the final ratification of the IEEE standard, Rohde & Schwarz has implemented first Wi-Fi 8 RF tests...
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₹3,700-Crore HCL–Foxconn Unit Powers India’s Chip Push
India’s semiconductor ambitions received a significant push with the foundation of a ₹3,700-crore chip assembly and test facility in Uttar...
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