17 Oct 2019 - STMicroelectronics has released the next generation of its STPay system-on-chip (SoC) payment solution, leveraging state-of-the-art technology to increase...
Read moreHigh quality, high reliability, AEC-Q101-qualified devices in DPAK Nijmegen, October 16, 2019: Nexperia, the expert in discrete and MOSFET components and analog &...
Read moreSEGGER announces the availability of real-time visualization with SystemView for RISC-V embedded systems. SystemView reveals the true runtime behavior of...
Read moreMajor global semiconductor vendor adds distributor to its security partner network, recognising Avnet Silica’s advanced expertise in embedded software and system-level...
Read moreIndustry’s Only Single-Chip ASIL-D-Compliant IC for Mid-to-Large Cell Count Configurations The MAX17853 leverages the same board for multiple pack sizes,...
Read moreHoofddorp, Netherlands: Murata has announced the PQU650 series of open-frame, 650 W-rated AC-DC power supplies by Murata Power Solutions. The...
Read moreIndustry leaders in automotive sensing technologies combine expertise to explore new levels of integration for advanced heterogeneous sensor fusion for...
Read moreTUALATIN, Ore. — October 15, 2019 — CUI Devices’ Interconnect Group (https://www.cuidevices.com/catalog/interconnect) today announced the addition of screwless terminal block connectors (https://www.cuidevices.com/catalog/interconnect/connectors/terminal-blocks)...
Read moreMunich, Germany – 15 October 2019 – Infineon Technologies AG will add a new member to its automotive microcontroller family AURIX™....
Read moreQualcomm Technologies, Inc., a wholly owned subsidiary of Qualcomm Incorporated, in collaboration with the Indian Space Research Organization (ISRO), today...
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