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Pinnacle Imaging SystemsTM Announces DenaliTM 3.0 Soft ISP & HDR Sensor Module for New Xilinx Kria SOM Platform and Vision AI Starter Kit
Combining the Denali ISP with the new plug-and-play Xilinx starter kit affords developers access to real-time, high quality HDR video...
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Nexperia announces new ESD protection devices for high-speed interfaces in automotive applications
High performance 4-channel ESD protection for automotive multimedia and video link applications offering ideal signal integrity Nijmegen, April 20, 2021:...
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Pre-Switch publishes highest efficiency figures for 200kW inverter
Over 99% efficient at 100kHz using 3 5mΩ MOSFETs Brings significant benefits to EV and renewables April 20 2020, Campbell,...
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MediaTek launches Dimensity 1200 SoC for Flagship 5G Smartphones in India
6nm SoC packed with advanced AI capabilities, up to 200MP camera support, multimedia, audio and gaming enhancements for incredible 5G...
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STMicroelectronics Speeds Smart Devices to Market with Extra Software for Microsoft® Azure RTOS Projects on STM32 MCUs
Fully integrated within STM32Cube ecosystem, software expansion packs build on recently announced joint initiative with Microsoft® Apr 19, 2021: STMicroelectronics...
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Infineon introduces industry’s first AEC-Q103 qualified high-performance XENSIV™ MEMS microphone for automotive applications
Munich, Germany – 16 April 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the launch of...
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Kick-off: Rutronik and Elmos launch partnership
Focus on automotive semiconductor solutions & international sales channels Manchester, UK – 15 April 2021 – Elmos Semiconductor SE and...
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SEGGER J-Link now supports CMSIS-DAP: One Probe Fits All
Monheim am Rhein, Germany – 15th April 2021 SEGGER's latest J-Link software makes it possible to turn J-Link into a...
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32bit D/A Converter IC for Hi-Fi Audio Equipment
ROHM's first, most advanced MUS-ICTM series DAC chip enables expressive playback of classical music ROHM announces the new BD34301EKV, a...
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InnovationLab wins ‘best prototype / new product’ at global OE-A awards
OccluSense® by Bausch recognised for innovation Heidelberg, Germany – April 14, 2021 – InnovationLab, the expert in printed electronics "from...
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