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Home Semiconductor News

AmberSemi Establishes Advisory Board with Six Industry Leaders as It Advances AI Datacenter Power Solutions

Semiconductor For You by Semiconductor For You
November 6, 2026
in Semiconductor News
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DUBLIN, Calif., Nov. 5, 2026, — Amber Semiconductor Inc., a developer of Direct-to-Core™ Vertical Power Delivery (VPD) modules for AI data centers, has announced the formation of its Advisory Board with the appointment of six highly experienced semiconductor and technology industry leaders.
The advisors bring extensive executive leadership, technical expertise, and industry experience to support AmberSemi as it scales its business and commercializes its PowerTile™ portfolio.
The incoming advisors are:
  • Robert Bruggeworth: President and CEO of Qorvo, former president of RF Micro Devices (RFMD).
  • Mike Noonen: Former CEO Swave Photonics and MixComm, former EVP of Global Foundries and NXP, & SVP of National Semiconductor.
  • David Bell: CEO of Actev Motors, former CEO of Intersil and President of Linear Tech.
  • George Holmes: Chairman and CEO of Stormentum, former CEO of Ubilite and Resonant.
  • Dan Christman: Chief Corporate Development Officer at SambaNova, former EVP/GM at Marvell, CMO at ESS and VP at Maxim.
  • Duane Nelles: Former SVP of Corporate Development and Strategy at Qualcomm.
“Our new advisors bring deep expertise across a range of disciplines, and their perspective will be invaluable as we scale,” said Thar Casey, CEO of AmberSemi. “That growth is driven by the increasing momentum behind our PowerTile portfolio, which we believe will be transformative for AI data centers.
“PowerTile represents a major advancement in power density at the final stage of power conversion, enabling thousands of amps to be delivered directly beneath the processor. By dramatically reducing distribution losses, PowerTiles improves overall efficiency while freeing up valuable power capacity within the datacenter.”
AmberSemi’s PowerTile Vertical Power Delivery (VPD) solution enables Direct-to-Core power conversion for next-generation AI accelerators and high-performance computing processors. The AMB7100, the first product in the PowerTile portfolio, delivers 1,000 A in an ultra-compact 20 x 24 x 1.68 mm package. Multiple devices can be paralleled to deliver more than 10,000 A.
PowerTile delivers a significant advancement in power density and performance compared with conventional power delivery architectures. As AI processors continue to push the limits of power consumption and current demand, traditional power delivery solutions are increasingly challenged to keep pace. AmberSemi’s Direct-to-Core VPD technology addresses this critical bottleneck by bringing power conversion directly beneath the processor to enable the next generation of AI performance while maximizing power efficiency, processor capability, and data center scalability.
For more information about AmberSemi and its PowerTile technology, please visit www.ambersi.com
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Tags: AmberSemiSemiconductorsVertical Power Delivery modules
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