GlobalFoundries of Santa Clara, CA, USA (one of the world’s largest semiconductor foundries, with more than 250 customers and operations...
Read moreDetailsDeposition equipment maker Aixtron SE of Herzogenrath, Germany has received an order for an AIX G5+ metal-organic chemical vapor deposition...
Read moreDetailsThe Quad Small Form Factor Pluggable Double Density (QSFP-DD) Multi Source Agreement (MSA) group has released an updated 3.0 Hardware...
Read moreDetailsTokyo-based Showa Denko K.K. (SDK) has decided to expand its facilities for producing high-quality-grade silicon carbide (SiC) epitaxial wafers for...
Read moreDetailsDeposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany has received an order for multiple metal-organic chemical vapor deposition...
Read moreDetailsNorth Carolina State University (NCSU) is rolling out a new manufacturing process and chip design for silicon carbide (SiC) power...
Read moreDetailsNorstel AB of Norrköping, Sweden has developed low-defect-density 150mm silicon carbide (SiC) n-type substrates. Norstel manufactures conductive (n-type) and semi-insulating...
Read moreDetailsThe 100G Lambda Multi-Source Agreement (MSA) Group has announced their intent to develop specifications based on 100Gbps per wavelength optical...
Read moreDetailsEvatec Ltd of Trübbach, Switzerland (which makes thin-film deposition and etch processing equipment for advanced packaging, power device, MEMS, optoelectronics,...
Read moreDetailsThe Compound Semiconductor Centre (CSC) - a joint venture between Cardiff University and epiwafer foundry and substrate maker IQE plc...
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