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Nexperia’s 650 V ultra- and hyperfast recovery rectifiers in D2PAK Real-2-Pin packaging offer high efficiency and reliability
Package configuration allows rectifiers to comply with higher creepage and clearance standards Nijmegen, July 10, 2024: Nexperia today released 650...
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WIN SOURCE Ranked 16th Among Global Electronic Component Distributors
Introduction Recently, WIN SOURCE, a leading global distributor of electronic components, was ranked 16th in the 2024 Top 50 Global...
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Nexperia to Invest 200 Million USD in Hamburg
Expansion of research & development (R&D) and production capacities for future technologies Hamburg, June 27, 2024: Semiconductor manufacturer Nexperia today...
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Renesas’ R-Car Open Access Platform Accelerates Software-Defined Vehicle Development With Market-Ready Software
RoX SDV Platform Combines Hardware, Out-of-Box Software and Cloud-Native AI Development Environment for ADAS, IVI and Gateway Systems TOKYO, Japan,...
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CML launches Ka-band GaN power amplifier for cost-effective development of commercial satcom terminals
17th June 2024 Maldon, Essex, UK – CML Micro has announced the launch of a Ka-band gallium nitride (GaN) power...
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3.1 USB C Plugs & Sockets Save Space & Accelerate Data Transfer
New Hyde Park, NY… Faster data transfer speeds, increased power transmission and smaller PCB footprints are key advantages of the...
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Renesas and Indian Institute of Technology Hyderabad Sign Agreement to Accelerate India’s Semiconductor Independence
Three-year Memorandum of Understanding Supports India's Domestic Technology Growth Strategy While Expanding Renesas' Presence in the Country's Chip Sector TOKYO,...
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Geely Auto Gears up NEV Transformation and Innovation with Long-Term SiC Supply Agreement and Joint Lab with STMicroelectronics
ST's third generation SiC MOSFETs help increase the powertrain efficiency for Geely Auto Group battery electric vehicles. Innovation Joint...
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High Current Rated Load Switches from Diodes Incorporated Provide Smart Power Delivery Solutions for Modern Digital ICs
Plano, Texas – May 28, 2024 – Diodes Incorporated (Nasdaq: DIOD) has announced the expansion of its highly successful DML30xx...
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Revolutionary Flip-Chip Die Bonder from ITEC is 5x faster than Current Market Leaders
Nijmegen, The Netherlands, 28.05.2024 - ITEC introduces the ADAT3 XF TwinRevolve flip-chip die bonder, which runs five times faster than...
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