Oslon Black Flat S claimed to be first surface mountable LED with up to five individually controllable chips
Osram Opto Semiconductors has launched the Oslon Black Flat S series, an LED designed for automotive adaptive front-lighting systems (AFS).
AFS emables the direction of the light beam to adjust when cornering, for example, providing drivers with the best possible visibility by illuminating the side of the road in addition to in front of the vehicle. This also protects oncoming traffic from glare through the adaptive driving beam (ADB).
The Oslon Black Flat S series is claimed to be the world’s first surface mountable LEDs with up to five individually controllable chips. The company showed an early prototype of the device back in September 2015.
Switchable light segments enable oncoming traffic and traffic further ahead on the road to be masked out, making driving more comfortable and safer. With their improved thermal properties, these high-power LEDs offer system benefits and are suitable as an attractive entry-level ADB solution even for vehicles in the compact class.
Thomas Christl, product manager at Osram Opto Semiconductors says: “Increasing visibility and reducing glare, adaptive front-lighting systems like Adaptive Driving Beam enhance safety and comfort for both drivers and traffic participants. Adaptive Driving Beam (ADB) is one of the most advanced AFS developments. Drivers virtually drive with an always-on high beam light distribution while other drivers on the road only experience low-beam glare. With camera integration, ADB detects other vehicles or obstacles and either dynamically shadows out these vehicles in order to prevent glare or illuminates these obstacles to ensure safety.”
The Oslon Black Flat S product combines benefits from both the Oslon Black Flat package and Osram Ostar Headlamp package. Featuring Osram Opto Semiconductors’ new chip technology with notchless chips, optical design can be simplified and further brightness improvements are made possible.
Oslon Black Flat S shows an optimised layout of thermal pads that help to dissipate the heat effectively, ensure light homogeneity and further improve second level reliability. As an SMT package it is possible to integrate these new functionalities and improved features easily and cost-efficiently using standard SMT processes.