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Renesas Launches Memory Module (MRDIMM) for AI Data Centers, Cloud and HPC

by Semiconductor For You

July 30, 2026

TOKYO, Japan — July 30, 2026 — Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced its third‑generation (Gen...

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How to Build a Remote Control Robotic Vehicle: 8 Easy Steps for Beginners

TDK presents DC-link capacitors rated for up to +135 °C in automotive and industrial applications