Applied Materials Announces Broadcom as EPIC Innovation Partner
Companies to collaborate on R&D to accelerate introduction of advanced packaging technologies for next-generation AI chips and systems Partnership will ...
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Tag: advanced packaging
Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX
National, India, Applied Materials, Inc. announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX ...
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INEMI’s 1Q26 Advanced Packaging Report Maps India’s Road to Semiconductor Manufacturing Readiness
INEMI’s India Advanced Packaging Manufacturing 1Q26 Report lays out a structured roadmap to build a domestic semiconductor ecosystem. Focused on ...
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ASMPT and KOKUSAI ELECTRIC Join Forces to Accelerate 2.5D and 3D Heterogeneous Integration Technology
Singapore, September 25, 2025 – ASMPT, the global leader in advanced packaging and assembly solutions, and KOKUSAI ELECTRIC CORPORATION, a ...
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