Collaborations at Applied’s EPIC Center in Silicon Valley and Intel’s R&D campus in Oregon aim to develop breakthroughs in next-generation ...
Read moreDetailsCompanies to collaborate on R&D to accelerate introduction of advanced packaging technologies for next-generation AI chips and systems Partnership will ...
Read moreDetailsNational, India, Applied Materials, Inc. announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX ...
Read moreDetailsINEMI’s India Advanced Packaging Manufacturing 1Q26 Report lays out a structured roadmap to build a domestic semiconductor ecosystem. Focused on ...
Read moreDetailsSingapore, September 25, 2025 – ASMPT, the global leader in advanced packaging and assembly solutions, and KOKUSAI ELECTRIC CORPORATION, a ...
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