MosChip Collaborates with EMASS on Silicon Implementation for its Breakthrough Edge AI SoC

MosChip’s silicon and product engineering execution supports EMASS’s ultra-low-power ECS-DoT SoC

Santa Clara, USA – Dec 4, 2025 – MosChip Technologies, a leading player in silicon and product engineering services, today announced its role in supporting EMASS’s ECS-DoT Edge AI System-on-Chip (SoC), an ultra-low-power chip designed for always-on intelligence in wearables, drones, industrial IoT, and edge sensors.

EMASS led the ECS-DoT’s architecture design and set ambitious targets for performance and energy efficiency, aiming for up to 93% faster processing and 90% lower energy use compared to conventional edge AI solutions. To support this effort, MosChip provided engineering services for the silicon implementation in 22nm technology – contributing to physical design flows, tape-out coordination, packaging, assembly, evaluation hardware, and validation activities. The collaboration enabled a fully functional SoC and evaluation platform.

“This collaboration demonstrates the impact of pairing innovative SoC architecture with experienced silicon engineering support,” said Srinivasa Rao Kakumanu, CEO & Managing Director at MosChip Technologies. “EMASS defined a highly differentiated architecture, and MosChip was pleased to support its silicon implementation through our physical design and product engineering services.”

ECS-DoT: Compact AI at the Extreme Edge

The ECS-DoT is a RISC-V-based Edge AI SoC that integrates dual neural accelerators and 4MB of on-chip memory. It enables real-time, milliwatt-class inference for vision, audio, and sensor workloads without cloud dependency. Optimized for power- and space-constrained applications, ECS-DoT provides always-on AI capabilities for drones, wearables, healthcare trackers, and industrial monitoring systems.

“MosChip played an important role in supporting the silicon implementation of our architecture,” said Mark Goranson, CEO at EMASS. “Their contributions in physical design, product engineering, and validation complemented our internal efforts and helped us bring a robust SoC to our OEM partners.”